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Publication Detail
Evaluation and optimization of the mechanical strength of bonds between metal foil and aluminum pads on thin ASICs using gold ball studs as micro-rivets
  • Publication Type:
  • Authors:
    Giagka V, Vanhoestenberghe A, Demosthenous A, Donaldson N
  • Publisher:
  • Publication date:
  • Place of publication:
    Helsinki, Finland
  • Pagination:
    1, 5
  • Name of conference:
    2014 Electronics System-Integration Technology Conference (ESTC)
No abstract found
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