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Publication Detail
Test chip for evaluating the packaging techniques for biomedical implantable devices
  • Publication Type:
  • Authors:
    Saeidi N, Alderman J, Demosthenous A, Donaldson N
  • Publisher:
    IEEE UKRI EMB Student Club
  • Publication date:
  • Place of publication:
  • Pagination:
    65, 66
  • Published proceedings:
    Proceedings of the 5th UKRI PG Conference in Biomedical Engineering and Medical Physics 2009: PGBIOMED09: 12 – 14 July 2009: University of Oxford
  • Editors:
    James CJ,Demanuele C,Jimenez-Gonzalez A
  • Status:
  • Language:
In this paper we briefly report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target application. These test chips have been designed and fabricated based on the Tyndall’s inhouse CMOS 1.5 micron technology. Each chip includes humidity, temperature and/or corrosion sensors. Different designs and sizes have been considered for these sensors to compare the sensors sensitivity and to select the optimum ones for the final chip. The sensors are being tested and the result obtained for one of the humidity sensors is presented.
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